Solar sensor

Sunny boy.
The Vision solar sensor has a trained eye for solar cells.

The solar industry is booming – solar cells have now become industrial mass-produced products. This involves a continuously increasing cost pressure – a sound, process-concurrent quality control of sensitive silicon wafers is therefore a must.

The new Vision solar sensor from SensoPar t is par ticularly effective: It enables early detection of wafer cracks and defects and thus avoids the unnecessary cost of machine downtimes.

Plug and Play

Use of the Vision solar sensor is simple and uncomplicated in comparison with a conventional image processing solution. The relevant functions for wafer and cell inspection, from the detection of the size and shape of the wafer to the location of defects and the setting of processing speed and inspection accuracy, are already pre-configured so that the sensor is ready for operation in just a few mouse clicks. It is fast, costs little and functions perfectly. Sunny times are ahead!

	Essential features in view: The Vision solar sensor operates precisely and reliably even in fast cycle processes. Inspection criteria can be quickly and easily defined with the aid of the straightforward operating software.
	Reliable detection of defects: The Vision solar sensor can detect minimal contour defects (2 x 2 pixels). Evaluation of subpixels enables a further increase in inspection accuracy.

Applications

• Exact positioning of wafers and cells
• Crack detection irrespective of the type of wafer or cell
• Cropping of heavily damaged wafers

Article "Solar Sensor With Sharp Focus"
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• Software

  FA 46 Vision Sensor

  Brochure Vision

  Vision systems for industrial automation

Highlights

• Automatic detection of wafer and cell geometry, with chamfer (monocrystalline wafer)
  and without chamfer (polycrystalline wafer)
• Reliable detection of imperfections on straight and curved contours
• Suitable for proximity mode and reflector mode applications
• Flexible setting of inspection criteria: e. g. tolerances for wafer size, position, rotation, size and number of authorised contour defects
• Easy improvement of the sensor with regard to evaluation speed and inspection accuracy (subpixel process)
• Freely adjustable cropping function for larger defects, e. g. 6" by 5"
• Distortion correction

Unavoidable risk of cracks:
Silicon wafers are only a few tenths of a millimetre thick and very brittle, which means that damage during the production process can never be completely excluded. This is no problem, provided it is detected early on!