The task
In modern semiconductor factories (fabs), wafer boxes, such as front-opening shipping boxes (FOSBs) or front-opening universal pods (FOUPs), are currently still often transported manually from station to station. These boxes are used for the safe transportation and temporary storage of sensitive wafers during the production process and must be handled with extreme care.
The challenge
Many fabs still rely on human labor to transport and position the wafer boxes. However, employees are a potential source of contamination that should be avoided as far as possible in the ultra-clean environment of semiconductor production. It is also becoming increasingly difficult to find staff for monotonous and repetitive tasks – especially in light of the growing shortage of skilled labor. Mobile robots can help to reduce both staff shortages and the risk of contamination. However, driverless transport systems like automated guided vehicles (AGVs) or autonomous mobile robots (AMRs) do not always provide precise positioning. Depending on the system type, position deviations of several centimeters can occur. These inaccuracies have a direct effect on the gripping position of the robot arm. If it misses the wafer box, it can damage the box or the wafers it contains. Filled wafer boxes are often worth between € 10,000 and € 100,000 – in some cases even significantly more.
Our solution
The VISOR® Robotic offers a precise and reliable solution for automated wafer box handling. In combination with the Target Mark 3D, the camera enables precise detection and position determination for the vehicle and the robot arm. The vision sensor provides the position coordinates in robot coordinates, allowing the robot to adjust its gripping points with precision – regardless of slight deviations on the part of the AGV. The vision sensor can be easily calibrated and recalibrated across robots, which reduces the effort required for integration, minimizes downtimes and significantly increases process reliability in the highly sensitive environment of semiconductor production.
Your advantages
- Precise 3D position data from a 2D vision sensor using the Target Mark 3D
- High process reliability and reduction of contamination risks
- Reduced effort required for integration
- Short downtime thanks to automated calibration and recalibration
